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STM32F411CEU6
STMicroelectronics
ICPlanet
ARM® Cortex®-M4 series Microcontroller IC 32-Bit 100MHz 512KB (512K x 8) FLASH 48-UFQFPN (7x7)
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TYPE | DESCRIPTION |
|---|---|
Category | Integrated Circuits (ICs) Embedded - Microcontrollers |
Mfr | STMicroelectronics |
Series | STM32F4 |
Package | Tray |
Part Status | Active |
Core Processor | ARM® Cortex®-M4 |
Core Size | 32-Bit |
Speed | 100MHz |
Connectivity | I²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
Number of I/O | 36 |
Program Memory Size | 512KB (512K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 128K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.7V ~ 3.6V |
Data Converters | A/D 10x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 48-UFQFN Exposed Pad |
Supplier Device Package | 48-UFQFPN (7x7) |
The STM32F411XC/XE devices are based on the high-performance Arm® Cortex® -M4 32- bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
• Up to three I2Cs
• Five SPIs
• Five I²Ss out of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.
• Three USARTs
• SDIO interface
• USB 2.0 OTG full speed interface
Features
• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
– 1.7 V to 3.6 V power supply
– - 40°C to 85/105/125 °C temperature range
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
– Up to 512 Kbytes of Flash memory
– 128 Kbytes of SRAM
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Power consumption
– Run: 100 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C
– Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C
– Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V
– VBAT supply for RTC: 1 µA @25 °C
• 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
• General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
• Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
• Debug mode
– Serial wire debug (SWD) & JTAG interfaces
– Cortex®-M4 Embedded Trace Macrocell™
• Up to 81 I/O ports with interrupt capability
– Up to 78 fast I/Os up to 100 MHz
– Up to 77 5 V-tolerant I/Os
• Up to 13 communication interfaces
– Up to 3 x I2C interfaces (SMBus/PMBus)
– Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• CRC calculation unit
• 96-bit unique ID
• RTC: subsecond accuracy, hardware calendar
• All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK®2
TYPE | DESCRIPTION |
|---|---|
Category | Integrated Circuits (ICs) Embedded - Microcontrollers |
Mfr | STMicroelectronics |
Series | STM32F4 |
Package | Tray |
Part Status | Active |
Core Processor | ARM® Cortex®-M4 |
Core Size | 32-Bit |
Speed | 100MHz |
Connectivity | I²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
Number of I/O | 36 |
Program Memory Size | 512KB (512K x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 128K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.7V ~ 3.6V |
Data Converters | A/D 10x12b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 48-UFQFN Exposed Pad |
Supplier Device Package | 48-UFQFPN (7x7) |
The STM32F411XC/XE devices are based on the high-performance Arm® Cortex® -M4 32- bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
• Up to three I2Cs
• Five SPIs
• Five I²Ss out of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.
• Three USARTs
• SDIO interface
• USB 2.0 OTG full speed interface
Features
• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
– 1.7 V to 3.6 V power supply
– - 40°C to 85/105/125 °C temperature range
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
– Up to 512 Kbytes of Flash memory
– 128 Kbytes of SRAM
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Power consumption
– Run: 100 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C
– Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C
– Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V
– VBAT supply for RTC: 1 µA @25 °C
• 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
• General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
• Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
• Debug mode
– Serial wire debug (SWD) & JTAG interfaces
– Cortex®-M4 Embedded Trace Macrocell™
• Up to 81 I/O ports with interrupt capability
– Up to 78 fast I/Os up to 100 MHz
– Up to 77 5 V-tolerant I/Os
• Up to 13 communication interfaces
– Up to 3 x I2C interfaces (SMBus/PMBus)
– Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• CRC calculation unit
• 96-bit unique ID
• RTC: subsecond accuracy, hardware calendar
• All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK®2
