Solderability test concept: During the assembly and welding process of electronic products, poor selection of flux quality for circuit boards, component solderable ends or solder paste will cause welding problems and directly affect the quality of products.The main welding problems include poor wetting, bridging, cracks, etc., which will increase the workload of quality control and generate a lot of maintenance, resulting in waste of manpower and financial resources, such as false welding, virtual welding and poor welding strength, etc., will directly lead to reliable sexual issues.Solderability test quantitatively evaluates the solderability of the tested samples by testing the solderability of the incoming materials, and directly provides guidance on whether the incoming materials can be put into production or can be put into production after the adjustment of the process window.For incoming batches of components, the solderability test is more meaningful for units with long storage time due to small output. Solderability evaluation can be performed on components before use to determine whether the use of this batch of components will Lead to the occurrence of welding quality problems.

 

Solderability test principle: Solderability test is to determine the quality of the sample according to the test results through the selection of the sample and the simulation of the welding process.In the electronics industry, solderability tests are performed by measuring the quality of the solder paste and flux used, the quality of the soldering process, etc., when evaluating the impact of mounting samples.The wetting balance (or wetting balance) test method uses a sensor to detect a small force level, combined with time to determine the strength of tin and rapid wetting.The specific sample is placed on the fixture, and the sample is immersed in the solder at a specified temperature. The force and time data are transmitted to the host computer through the sensor, and the curve and data file are formed through the software to evaluate the welding quality accurately and quantitatively.

 

1. Solderability test is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc.In the assembly welding process of electronic products, the welding quality directly affects the quality of the whole machine.Therefore, in order to improve the welding quality, in addition to strictly controlling the process parameters, it is also necessary to conduct scientific solderability tests on printed circuit boards and electronic components.

2. Through the implementation of solderability test, help enterprises to determine the quality of solderability and product quality after production and assembly.In practical operation, it has further enriched the solderability testing techniques for components such as printed circuit boards, clarified the internal factors affecting solderability, and provided technical engineers in the manufacturing industry to improve product quality and zero-defect welding process. a great help.

 

Slice analysis steps: sampling→cleaning→vacuum mounting→grinding→polishing→microetching (if necessary)→analysis (OM observation, SEM observation, EDS analysis, EBSD analysis, etc.)

 

 

 

Scope of application: All chip tests that can support programming.

 

 

 

Scope of application: metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components, etc. internal cracks, foreign matter defect detection, analysis of internal displacement of BGA, circuit boards, etc.; identification of empty soldering, virtual soldering Analysis of BGA soldering defects, etc.

 

 

Introduction to X-Ray inspection: X-ray (X-ray) detector uses low-energy X-rays to quickly detect the inspected object without damaging the inspected object.Use high voltage to strike the target to generate X-ray penetration to detect the internal structure quality of electronic components, semiconductor packaging products, and the welding quality of various types of SMT solder joints.

 

X-Ray inspection content: 

1.Defect inspection in IC packaging, such as: layer peeling, burst, void, and integrity inspection of bonding wires; 

2.Defects that may occur during the printed circuit board process, such as: poor alignment or bridging and open circuits ; 

3. Detection and measurement of voids in SMT solder joints; 

4. Defect inspection of open circuits, short circuits or abnormal connections that may occur in various connection lines; 

5. Integrity of solder balls in solder ball array packages and chip-on-chip packages Inspection; 

6. High-density plastic material cracking or metal material void inspection; 

7. Chip size measurement, wire bonding arc measurement, component solder area ratio measurement.

 

Confirm the test location and requirements of the sample type/material → put the sample into the inspection table of the X-Ray perspective instrument for X-Ray perspective inspection → judge and analyze the picture → mark the defect type and location.

 

X-Ray inspection items: 

1. Integrated circuit packaging process inspection: layer peeling, cracking, void and wire bonding process; 

2. Printed circuit board manufacturing process inspection: welding line offset, bridging, open circuit; 

3. Surface mount technology Solderability inspection: detection and measurement of solder joint voids; 

4. Connection line inspection: open circuit, short circuit, abnormal or bad connection defects; 

5. Integrity inspection of solder balls in solder ball array packaging and chip-on-chip packaging; 

6. High Density plastic material cracking or metal material inspection; 

7. Chip size measurement, wire bonding arc measurement, component solder area ratio measurement.

 

Applications: Critical functional verification of all semiconductor devices.

 

 

 

 

 

Application scope: verification of chip authenticity and failure analysis, etc.

 

 

The uncap test, also known as DECAP, is a destructive experiment. It uses chemical reagents or laser etching to remove the outer packaging shell of the component to check the original logo, layout, and process on the surface of the grain. Defects, etc., the open cover test is an auxiliary test method.

 

Ordinary packages COB, BGA, QFP, QFN, SOT, TO, DIP, BGA, COB ceramic, metal and other special packages.Generally, there are chemical (Chemical) unsealing, mechanical (Mechanical) unsealing, laser (Laser) unsealing, PlasmaDecap 

 

Decap laboratory can handle almost all IC packaging forms (COB.QFP.DIPSOT, etc.), wire bonding type (AuCuAg).

 

Precautions for opening (unsealing) 

 

1. All operations should be carried out in a fume hood, and acid-proof gloves should be worn.

2. The more the product is opened, the less acid it will drop to the end, and it should be cleaned frequently to avoid over-corrosion.

3. Be careful not to touch the surface of the gold wire and the chip with the tweezers during the cleaning process, so as not to scratch the chip and the gold wire.

4. According to the product or analysis requirements, the conductive adhesive under the chip or the second point should be exposed after uncapping.

5.In addition, in some cases, the uncapped products should be retested in rows.At this time, first put it under a microscope at 80 times to see if the gold wire on the chip is broken or tattered. If there is no wire, use a blade to scrape off the black film on the pin and send it for testing.

6. Be careful not to control the cap opening temperature too high.

 

 

 

 

 

 

1.The standard inspection is based on the comparison and analysis of the label photo provided by the customer with the original label, official website information, etc., so as to distinguish its authenticity; 

2.The conclusion of the bid inspection is for reference only, and the actual product shall prevail. If you need to confirm whether the product is original, you can provide a sample for appearance inspection or open the cover for comparison and verification; 

3.In order to protect the vast number of purchasing friends, the problematic points of the label cannot be pointed out for the time being, so as to prevent counterfeiters from knowing the reason; 

4.The standard inspection service is voluntary, and the customer bears the risk. Chuangxin Online Testing Center will not bear any consequences or legal responsibility for this.