What is testing and packaging technology for chips? Chip testing and packaging: what are they?

Many devices in today's society require chip support. There won't be any cutting-edge, high-tech equipment without chip support. To obtain independent chips to meet the requirements of high-tech equipment, the chip packaging and testing technology first runs a batch of wafers through the test before performing special processing in accordance with the functions demanded by the equipment and the corresponding product models. Therefore, the testing and packaging of chips is essential to the advancement of technology today. What then is testing and packaging technology for chips? Chip testing and packaging: what are they? may want to allow us to look!

Typically, there are two stages to chip packaging and testing technology. The first stage is a series of operations known as the front stage. The back section is the sequence of steps that follow molding. The front section and the back section work together to form the chip's entire packaging and testing process. Only then can the packaging and testing technology be used to transform the produced qualified wafers into chips with particular features and models.

Backside thinning, round mirror cutting, optical inspection, and chip bonding are the main front-ends of the packaging and testing technology. To make sure the round mirror is as thick as the package, it must be thinned through the back. Pay attention to the circuit area's protection when grinding the back, and generally use the amount of glue that has been pasted on the front. Then, while determining whether the product contains waste products, it prevents oxidation using circular mirror cutting, optical inspection, and chip bonding.

The latter part of the packaging and testing technology is injection molding, laser typing, high temperature curing, deflashing, electroplating, and slicing forming inspection of waste products. The operation of injection molding is mainly to protect the chip from external impact, and the product is packaged and tested with plastic packaging compound. Laser typing is to engrave some corresponding content on the product, such as the date of production, batch and model, and other information related to the chip. High- temperature curing is to protect the internal structure of the IC, eliminate internal stress, and enhance the stability of the chip. Finally, through electroplating, the conductivity and solderability of the product are improved. It is then possible to check for rejects while slicing into shape. Such a series of operations is the chip packaging and testing technology required for the development of many high- tech equipment.

All in all, the above is the chip packaging and testing technology.