Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded - FPGAs (Field Programmable Gate Array) | |
Mfr | Intel |
Series | Cyclone® V EE |
Package | Tray |
Part Status | Active |
Number of LABs/CLBs | 113560 |
Number of Logic Elements/Cells | 301000 |
Total RAM Bits | 14251008 |
Number of I/O | 480 |
Voltage - Supply | 1.07V ~ 1.13V |
Mounting Type | Surface Mount |
Operating Temperature | ·-40℃ ~ 100℃(TJ) |
Package / Case | 896-BGA |
Supplier Device Package | 896-FBGA (31x31) |
Lower power consumption
• Built on TSMC's 28 nm low-power (28LP) process technology and includes an abundance of hard intellectual property (IP) blocks
• Up to 40% lower power consumption than the previous generation device
Improved logic integration and differentiation capabilities
• 8-input adaptive logic module (ALM)
• Up to 13.59 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity
• 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
• Hard memory controllers
Hard processor system (HPS)with integrated Arm Cortex-A9 MPCore processor
• Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an FPGA in a single Cyclone V system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between the processor and the FPGA fabric
Lowest system cost
• Requires only two core voltages to operate
• Available in low-cost wirebond packaging
• Includes innovative features such as Configuration via Protocol (CvP) and partial reconfiguration
Technology
• TSMC's 28-nm low-power (28LP) process technology
• 1.1 V core voltage
Packaging
• Wirebond low-halogen packages
• Multiple device densities with compatible package footprints for seamless migration between different device densities
• RoHS-compliant and leaded(1)options
High-performance FPGA fabric
Enhanced 8-input ALM with four registers Internal memory blocks
• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory
Embedded Hard IP blocks:
(1)Variable-precision DSP:
• Native support for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same variable-precision DSP block
• 64-bit accumulator and cascade
• Embedded internal coefficient memory
• Preadder/subtractor for improved efficiency
(2)Memory controller:
•DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support
(3)Embedded transceiver I/O
•PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with multifunction support, endpoint, and root port
Clock networks
• Up to 550 MHz global clock network
• Global, quadrant, and peripheral clock networks
• Clock networks that are not used can be powered down to reduce dynamic power
Phase-locked loops(PLLs)
• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
• Integer mode and fractional mode
FPGA General-purpose I/Os (GPIOs)
• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
• 400 MHz/800 Mbps external memory interface
• On-chip termination (OCT)
• 3.3 V support with up to 16 mA drive strength
Low-power high-speed serial interface
• 614 Mbps to 6.144 Gbps integrated transceiver speed
• Transmit pre-emphasis and receiver equalization
• Dynamic partial reconfiguration of individual channels
HPS(Cyclone V SE, SX, and ST devices only)
• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with support for symmetric and asymmetric multiprocessing
• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0
On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO interfaces
• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers
• On-chip RAM and boot ROM
Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded - FPGAs (Field Programmable Gate Array) | |
Mfr | Intel |
Series | Cyclone® V EE |
Package | Tray |
Part Status | Active |
Number of LABs/CLBs | 113560 |
Number of Logic Elements/Cells | 301000 |
Total RAM Bits | 14251008 |
Number of I/O | 480 |
Voltage - Supply | 1.07V ~ 1.13V |
Mounting Type | Surface Mount |
Operating Temperature | ·-40℃ ~ 100℃(TJ) |
Package / Case | 896-BGA |
Supplier Device Package | 896-FBGA (31x31) |
Lower power consumption
• Built on TSMC's 28 nm low-power (28LP) process technology and includes an abundance of hard intellectual property (IP) blocks
• Up to 40% lower power consumption than the previous generation device
Improved logic integration and differentiation capabilities
• 8-input adaptive logic module (ALM)
• Up to 13.59 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity
• 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
• Hard memory controllers
Hard processor system (HPS)with integrated Arm Cortex-A9 MPCore processor
• Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an FPGA in a single Cyclone V system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between the processor and the FPGA fabric
Lowest system cost
• Requires only two core voltages to operate
• Available in low-cost wirebond packaging
• Includes innovative features such as Configuration via Protocol (CvP) and partial reconfiguration
Technology
• TSMC's 28-nm low-power (28LP) process technology
• 1.1 V core voltage
Packaging
• Wirebond low-halogen packages
• Multiple device densities with compatible package footprints for seamless migration between different device densities
• RoHS-compliant and leaded(1)options
High-performance FPGA fabric
Enhanced 8-input ALM with four registers Internal memory blocks
• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory
Embedded Hard IP blocks:
(1)Variable-precision DSP:
• Native support for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same variable-precision DSP block
• 64-bit accumulator and cascade
• Embedded internal coefficient memory
• Preadder/subtractor for improved efficiency
(2)Memory controller:
•DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support
(3)Embedded transceiver I/O
•PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with multifunction support, endpoint, and root port
Clock networks
• Up to 550 MHz global clock network
• Global, quadrant, and peripheral clock networks
• Clock networks that are not used can be powered down to reduce dynamic power
Phase-locked loops(PLLs)
• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
• Integer mode and fractional mode
FPGA General-purpose I/Os (GPIOs)
• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
• 400 MHz/800 Mbps external memory interface
• On-chip termination (OCT)
• 3.3 V support with up to 16 mA drive strength
Low-power high-speed serial interface
• 614 Mbps to 6.144 Gbps integrated transceiver speed
• Transmit pre-emphasis and receiver equalization
• Dynamic partial reconfiguration of individual channels
HPS(Cyclone V SE, SX, and ST devices only)
• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with support for symmetric and asymmetric multiprocessing
• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0
On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO interfaces
• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers
• On-chip RAM and boot ROM