Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded - FPGAs (Field Programmable Gate Array) | |
Mfr | Intel |
Series | Cyclone庐 V E |
Package | Tray |
Part Status | Active |
Number of LABs/CLBs | 56480 |
Number of Logic Elements/Cells | 149500 |
Total RAM Bits | 7880704 |
Number of I/O | 240 |
Voltage - Supply | 1.07V ~ 1.13V |
Mounting Type | Surface Mount |
Operating Temperature | ·-40℃~ 100℃ (TJ) |
Package / Case | 484-BGA |
Supplier Device Package | 484-FBGA (23x23) |
Cyclone V Device Overview
The Cyclone® V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and cost-sensitive applications. Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable for applications in the industrial, wireless and wireline, military, and automotive markets.
Lower power consumption:
• Built on TSMC's 28 nm low-power (28LP) process technology and includes an abundance of hard intellectual property (IP) blocks
• Up to 40% lower power consumption than the previous generation device
Improved logic integration and differentiation capabilities:
• 8-input adaptive logic module (ALM)
• Up to 13.59 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity :
• 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
• Hard memory controllers
Hard processor system (HPS)with integrated Arm* Cortex*-A9 MPCore* processor
• Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an FPGA in a single Cyclone V system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between the processor and the FPGA fabric
Lowest system cost • Requires only two core voltages to operate
• Available in low-cost wirebond packaging
• Includes innovative features such as Configuration via Protocol (CvP) and partial reconfiguration
Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Embedded - FPGAs (Field Programmable Gate Array) | |
Mfr | Intel |
Series | Cyclone庐 V E |
Package | Tray |
Part Status | Active |
Number of LABs/CLBs | 56480 |
Number of Logic Elements/Cells | 149500 |
Total RAM Bits | 7880704 |
Number of I/O | 240 |
Voltage - Supply | 1.07V ~ 1.13V |
Mounting Type | Surface Mount |
Operating Temperature | ·-40℃~ 100℃ (TJ) |
Package / Case | 484-BGA |
Supplier Device Package | 484-FBGA (23x23) |
Cyclone V Device Overview
The Cyclone® V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and cost-sensitive applications. Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable for applications in the industrial, wireless and wireline, military, and automotive markets.
Lower power consumption:
• Built on TSMC's 28 nm low-power (28LP) process technology and includes an abundance of hard intellectual property (IP) blocks
• Up to 40% lower power consumption than the previous generation device
Improved logic integration and differentiation capabilities:
• 8-input adaptive logic module (ALM)
• Up to 13.59 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity :
• 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
• Hard memory controllers
Hard processor system (HPS)with integrated Arm* Cortex*-A9 MPCore* processor
• Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an FPGA in a single Cyclone V system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between the processor and the FPGA fabric
Lowest system cost • Requires only two core voltages to operate
• Available in low-cost wirebond packaging
• Includes innovative features such as Configuration via Protocol (CvP) and partial reconfiguration